ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,549,927, issued on Feb. 10, was assigned to JIO PLATFORMS Ltd. (Ahmedabad, India). "System and method for broadcasting or multicasting content ... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,704, issued on Feb. 10, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Subtractive skip via" was invented by Nichol... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,547,753, issued on Feb. 10, was assigned to Airia LLC (Alpharetta, Ga.). "Dynamic privilege adjustment for data accessible to artificial intell... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,549,428, issued on Feb. 10, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Data processing method and related device" was in... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,545,881, issued on Feb. 10, was assigned to iPreg Inc. (Taipei, Taiwan). "Heating culture device used to provide environment with vertical temp... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,545,417, issued on Feb. 10, was assigned to Performance Drone Works LLC (Huntsville, Ala.). "Adaptive controller for unmanned aircraft" was inv... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,544,797, issued on Feb. 10, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "High speed substrate sorter" was invented by Asaf Sc... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,543,811, issued on Feb. 10. "Brim clip" was invented by Lisa Thompson (Brookfield, Wis.). According to the abstract* released by the U.S. Pate... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,549,565, issued on Feb. 10, was assigned to Marvell Asia Pte Ltd (Singapore). "System and method for intrusion detection of malware traffic" wa... Read More
ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,772, issued on Feb. 10, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Semiconductor package conductive terminals with reduced plating t... Read More